JPH0419317B2 - - Google Patents
Info
- Publication number
- JPH0419317B2 JPH0419317B2 JP23618886A JP23618886A JPH0419317B2 JP H0419317 B2 JPH0419317 B2 JP H0419317B2 JP 23618886 A JP23618886 A JP 23618886A JP 23618886 A JP23618886 A JP 23618886A JP H0419317 B2 JPH0419317 B2 JP H0419317B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- tape
- tilting plate
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002390 adhesive tape Substances 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 14
- 238000005520 cutting process Methods 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 5
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical class C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23618886A JPS6393885A (ja) | 1986-10-06 | 1986-10-06 | プリント基板端子のメツキ防止用テ−プ貼り付け装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23618886A JPS6393885A (ja) | 1986-10-06 | 1986-10-06 | プリント基板端子のメツキ防止用テ−プ貼り付け装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6393885A JPS6393885A (ja) | 1988-04-25 |
JPH0419317B2 true JPH0419317B2 (en]) | 1992-03-30 |
Family
ID=16997078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23618886A Granted JPS6393885A (ja) | 1986-10-06 | 1986-10-06 | プリント基板端子のメツキ防止用テ−プ貼り付け装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6393885A (en]) |
-
1986
- 1986-10-06 JP JP23618886A patent/JPS6393885A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6393885A (ja) | 1988-04-25 |
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