JPH0419317B2 - - Google Patents

Info

Publication number
JPH0419317B2
JPH0419317B2 JP23618886A JP23618886A JPH0419317B2 JP H0419317 B2 JPH0419317 B2 JP H0419317B2 JP 23618886 A JP23618886 A JP 23618886A JP 23618886 A JP23618886 A JP 23618886A JP H0419317 B2 JPH0419317 B2 JP H0419317B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
tape
tilting plate
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP23618886A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6393885A (ja
Inventor
Hitoshi Motosugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takeuchi Manufacturing Co Ltd
Original Assignee
Takeuchi Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takeuchi Manufacturing Co Ltd filed Critical Takeuchi Manufacturing Co Ltd
Priority to JP23618886A priority Critical patent/JPS6393885A/ja
Publication of JPS6393885A publication Critical patent/JPS6393885A/ja
Publication of JPH0419317B2 publication Critical patent/JPH0419317B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP23618886A 1986-10-06 1986-10-06 プリント基板端子のメツキ防止用テ−プ貼り付け装置 Granted JPS6393885A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23618886A JPS6393885A (ja) 1986-10-06 1986-10-06 プリント基板端子のメツキ防止用テ−プ貼り付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23618886A JPS6393885A (ja) 1986-10-06 1986-10-06 プリント基板端子のメツキ防止用テ−プ貼り付け装置

Publications (2)

Publication Number Publication Date
JPS6393885A JPS6393885A (ja) 1988-04-25
JPH0419317B2 true JPH0419317B2 (en]) 1992-03-30

Family

ID=16997078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23618886A Granted JPS6393885A (ja) 1986-10-06 1986-10-06 プリント基板端子のメツキ防止用テ−プ貼り付け装置

Country Status (1)

Country Link
JP (1) JPS6393885A (en])

Also Published As

Publication number Publication date
JPS6393885A (ja) 1988-04-25

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